Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface-Reference-Cited by-同舟云学术

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Published:2010-09-29 Issue:12 Volume:39 Page:2669-2679
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Zhou Bite,Bieler Thomas R.,Lee Tae-kyu,Liu Kuo-Chuan

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-010-1380-4.pdf

Reference15 articles.

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3. T.R. Bieler, H. Jiang, L.P. Lehman, T. Kirkpatrick, E.J. Cotts, and B. Nandagopal, IEEE Trans. Compon. Packag. Technol. (CPMT) 31, 370 (2008).

4. S. Terashima, T. Kohno, A. Mizusawa, K. Arai, O. Okada, T. Wakabayashi, M. Tanaka, and K. Tatsumi, J. Electron. Mater. 38, 33 (2009).

5. S. Terashima, T. Kobayashi, and M. Tanaka, Sci. Technol. Weld. Join. 13, 732 (2008).

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