Author:
Ben Romdhane E.,Guédon-Gracia A.,Pin S.,Roumanille P.,Frémont H.
Funder
Agence Nationale de la Recherche
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference19 articles.
1. Solder joint fatigue models: review and applicability to chip scale packages;Lee;Microelectron. Reliab.,2000
2. The Microstructure of Sn in near-Eutectic Sn – Ag – Cu Alloy Solder Joints and its Role in Thermomechanical Fatigue;Henderson,2004
3. Statistical Study of SAC Solder Joints in QFN and BGA Assemblies;Gracia,2019
4. Accumulated Creep Strain and Energy Density Based Thermal Fatigue Life Prediction Models for SnAgCu Solder Joints;Syed,2004
5. Microstructure and damage evolution in Sn-Ag-Cu solder joints;Lehman;Proc. - Electron. Components Technol. Conf.,2005
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