Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications-Reference-Cited by-同舟云学术

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Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications

Published:2022-12-16 Issue:2 Volume:11 Page:203-211
ISSN:2095-3127
Container-title:Advances in Manufacturing
language:en
Short-container-title:Adv. Manuf.

Author:

Zhu Wen-Hui,Xiao Xiao-Yu,Chen Zhuo^ORCID,Chen Gui,Yan Ya-Mei,Wang Lian-Cheng,Li Gang-Long

Funder

National Natural Science Foundation of China

Natural Science Foundation of Hunan Province

State Key Laboratory of High Performance Complex Manufacturing

Key Laboratory in Science and Technology Development Project of Suzhou

Publisher

Springer Science and Business Media LLC

Subject

Industrial and Manufacturing Engineering,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials

Link

https://link.springer.com/content/pdf/10.1007/s40436-022-00419-9.pdf

Reference35 articles.

1. Datta M (2019) Manufacturing processes for fabrication of flip-chip micro-bumps used in microelectronic packaging: an overview. J Micromanuf 3:69–83

2. Lau JH (2022) Recent advances and trends in advanced packaging. IEEE Trans Comp Pack Manuf Technol 12:228–252

3. Higurashi E (2018) Heterogeneous integration based on low-temperature bonding for advanced optoelectronic devices. Jpn J Appl Phys 57:04FA02. https://doi.org/10.7567/jjap.57.04fa02

4. Malik MH, Grosso G, Zangl H et al (2021) Flip chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives. Microelectron Reliab 123:114204. https://doi.org/10.1016/j.microrel.2021.114204

5. Chen Z, Gengenbach U, Liu X et al (2022) An automated room temperature flip-chip mounting process for hybrid printed electronics. Micromachines (Basel). https://doi.org/10.3390/mi13040583

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1. Fabrication and bonding of In bumps on Micro-LED with 8 μm pixel pitch;Engineering Research Express;2024-04-04

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