Significant Inhibition of Interfacial Cu6sn5 Imc and Improvement of Solder Joint Strength and Reliability by Applying (111) Nanotwinned Cu Substrate and Vacuum Soldering
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Elsevier BV
Reference25 articles.
1. Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi-AlN/Cu solder joints applied in IGBT modules;X Wang;J. Mater. Res. Technol-JMRT,2022
2. Study on the microstructure and mechanical property of Cu-foam modified Sn3.0Ag0.5Cu solder joints by ultrasonic-assisted soldering;X Yi;J. Manuf. Process,2021
3. Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish;K Vidyatharran;J. Mater. Res. Technol-JMRT,2021
4. Study on the dual inhibition behavior of interfacial IMCs in Cu/SAC105/Cu joint by adopting SiC nanowires and nanocrystalline Cu substrate;X Lu;Journal of Materials Research and Technology,2023
5. Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper;H Y Hsiao;Science,2012
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