Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper-Reference-Cited by-同舟云学术

Unidirectional Growth of Microbumps on (111)-Oriented and Nanotwinned Copper

Published:2012-05-25 Issue:6084 Volume:336 Page:1007-1010
ISSN:0036-8075
Container-title:Science
language:en
Short-container-title:Science

Author:

Hsiao Hsiang-Yao¹,Liu Chien-Min¹,Lin Han-wen¹,Liu Tao-Chi¹,Lu Chia-Ling¹,Huang Yi-Sa¹,Chen Chih¹,Tu K. N.²

Affiliation:

1. Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu, Taiwan 30010, Republic of China.

2. Department of Materials Science and Engineering, University of California at Los Angeles, Los Angeles, CA 90095, USA.

Abstract

Tiny Tinny Bumps One challenge in moving to three-dimensional integrated circuit architectures is the need for aligned interconnects to join neighboring layers. Hsiao et al. (p. 1007 ) applied rapid stirring to the direct current electroplating of copper to produce films with oriented copper grains that have a high density of nanotwin defects. The resulting material was an excellent platform for the growth of copper-tin intermetallic compounds in the form of arrays of microbumps potentially suitable for the soldering of electronic components.

Publisher

American Association for the Advancement of Science (AAAS)

Subject

Multidisciplinary

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