Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2936996
Reference8 articles.
1. Physics and materials challenges for lead-free solders
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4. Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin
5. Diffusion of Gold and Silver in Tin Single Crystals
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