Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps-Reference-Cited by-同舟云学术

Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps

Published:2024-05 Issue: Volume:30 Page:1136-1147
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Mao Xingchao^ORCID,An Yuxuan^ORCID,Chen Yang,Zheng Gong,Hou Rui,Zhang Xinyu,Guo Yuzheng,Liu Sheng,Tu King-Ning,Liu Yingxia^ORCID

Funder

City University of Hong Kong

Shenzhen Science and Technology Innovation Commission

National Natural Science Foundation of China

University Grants Committee Research Grants Council

University Grants Committee

Publisher

Elsevier BV

Reference43 articles.

1. Nanotwinning-assisted structurally stable copper for fine-pitch redistribution layer in 2.5 D/3D IC packaging;Chen;J Mater Res Technol,2023

2. Characterization of low-height solder microbump bonding for fine-pitch inter-chip connection in 3DICs. 2019;Miwa;International 3D Systems Integration Conference (3DIC),2019

3. Recent progress in SLID bonding in novel 3D-IC technologies;Sun;J Alloys Compd,2020

4. Evaluation of the potential electromagnetic interference in vertically stacked 3D integrated circuits;Kapoor;Appl Sci,2020

5. Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology;Wu;J Mater Res Technol,2023

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Corrosion resistance and electrochemical migration behavior of InSnBiAgxZn low-melting-point alloy solders;Journal of Materials Research and Technology;2024-09