Author:
Wu Xuefeng,Sun Lingyao,Liu Yingxia,Ye Ziting,Zhao Xiuchen,Liu Ying
Funder
National Natural Science Foundation of China
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference39 articles.
1. Low melting point solders based on Sn, Bi, and in elements;Liu;Mater Today Advances,2020
2. Effect of Joule heating and current crowding on electromigration in mobile technology;Tu;Appl Phys Rev,2017
3. Enhancement of structure and properties of Sn58Bi solder by AlN ceramic particles;Wang;J Mater Res Technol,2022
4. Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi–AlN/Cu solder joints applied in IGBT modules;Wang;J Mater Res Technol,2022
5. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles;Chen;J Mater Res Technol,2023
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献