Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology

Author:

Wu Xuefeng,Sun Lingyao,Liu Yingxia,Ye Ziting,Zhao Xiuchen,Liu Ying

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference39 articles.

1. Low melting point solders based on Sn, Bi, and in elements;Liu;Mater Today Advances,2020

2. Effect of Joule heating and current crowding on electromigration in mobile technology;Tu;Appl Phys Rev,2017

3. Enhancement of structure and properties of Sn58Bi solder by AlN ceramic particles;Wang;J Mater Res Technol,2022

4. Growth behavior and reliability of interfacial IMC for Sn58Bi/Cu and Sn58Bi–AlN/Cu solder joints applied in IGBT modules;Wang;J Mater Res Technol,2022

5. Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles;Chen;J Mater Res Technol,2023

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