Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish-Reference-Cited by-同舟云学术

Microstructural and shear strength properties of GNSs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish

Published:2021-11 Issue: Volume:15 Page:2497-2506
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Vidyatharran K.^ORCID,Azmah Hanim M.A.,Dele-Afolabi T.T.,Matori K.A.,Saliza Azlina O.^ORCID

Funder

Universiti Putra Malaysia

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference50 articles.

1. Effects of surface diffusion and reaction-induced volume shrinkage on morphological evolutions of micro joints;Yang;Mater Chem Phys,2017

2. Low temperature bonding for high temperature applications by using SnBi solders;Yang;J Alloys Compd,2015

3. The critical oxide thickness for Pb-free reflow soldering on Cu substrate;Chung;Thin Solid Films,2012

4. Influence of multi-walled carbon nanotubes on melting temperature and microstructural evolution of Pb-free Sn-5Sb/Cu solder joint;Dele-Afolabi;IOP Conf Ser Mater Sci Eng,2017

5. An efficient composite material for selective lead (II) monitoring and removal from wastewater;Awual;J Environ Chem Eng,2019

Cited by 32 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07

2. Thermal, microstructural, wettability and mechanical properties of Sn1.0Ag0.5Cu composite solder modified with Ti nanoparticles;Materials Characterization;2024-06

3. Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder;Materials Today Communications;2024-06

4. Thermal Transformation of Discarded CRT Printed Circuit Boards for Recovery of Sn Values;Metallurgical and Materials Transactions B;2024-05-07

5. Strong composite SnAgCu solder joints with internal aligned carbon fibers by magnetic field;Journal of Materials Processing Technology;2024-05