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The critical oxide thickness for Pb-free reflow soldering on Cu substrate

  • Published:2012-06 Issue:16 Volume:520 Page:5346-5352
  • ISSN:0040-6090
  • Container-title:Thin Solid Films
  • language:en
  • Short-container-title:Thin Solid Films

Author:

Chung C. Key,Chen Y.J.,Li C.C.,Kao C.R.

Funder

National Science Council

Intel Microelectronics Asia Ltd

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Surfaces, Coatings and Films,Surfaces and Interfaces,Electronic, Optical and Magnetic Materials

Cited by 24 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Insights into the Solder Non-wetting Failure due to Flux Inactivation and Degradation;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05

2. Influence of No-Clean Flux on the Corrosivity of Various Surface Finishes After Reflow;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

3. Micro Ball Mount Process for High Performance Fan-Out Large Panel Level Packaging Back-end Process;2023 International Conference on Electronics Packaging (ICEP);2023-04-19

4. Resistivity Scaling in Epitaxial CuAl2(001) Layers;IEEE Transactions on Electron Devices;2022-09

5. Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0Ag-0.5Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish;Journal of Materials Science: Materials in Electronics;2022-03-07
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