Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies
Author:
Affiliation:
1. Department of Industrial and Systems Engineering, Auburn University, Auburn, AL, USA
Funder
NSF Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) at Auburn University
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/5503870/10500445/10436070.pdf?arnumber=10436070
Reference42 articles.
1. Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events
2. Board-Level Drop Impact Reliability of Silicon Interposer-Based 2.5-D IC Integration
3. Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging
4. Effect of temperature on the low cycle fatigue properties of BGA solder joints
5. Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
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1. Drop Shock Testing Analysis at Elevated Temperature: Assessing SAC305 Solder Alloy Reliability in BGA Assemblies;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08
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3. Comparative study of lead-free alloys submitted to thermomechanical ageing;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
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