Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Intermetallic compound layer growth between SnAgCu solder and Cu substrate in electronic packaging

Published:2013-04-21 Issue:9 Volume:24 Page:3249-3254
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Zhang Liang,Fan Xi-ying,He Cheng-wen,Guo Yong-huan

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-013-1236-9.pdf

Reference36 articles.

1. L. Zhang, C.W. He, Y.H. Guo, J.G. Han, Y.W. Zhang, X.Y. Wang, Development of SnAg-based lead-free solders in electronics packaging[J]. Microelectron. Reliab. 52(3), 559–578 (2012)

2. H.F. Zou, H.J. Yang, Z.F. Zhang, Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals[J]. Acta Mater. 56(11), 2649–2662 (2008)

3. D.G. Kim, S.B. Jung, Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate[J]. J. Alloy. Compd. 386(1–2), 151 (2005)

4. L. Zhang, S.B. Xue, L.L. Gao, Y. Chen, S.L. Yu, Z. Sheng, G. Zeng, Microstructure and creep properties of Sn–Ag–Cu lead-free solders bearing minor amounts of the rare earth cerium[J]. Solder. Surf. Mount Technol. 22(2), 30 (2010)

5. J. Li, J. Karooinen, T. Laurila, K. Kivilahti, Reliability of lead-free solder interconnections in thermal and power cycling tests[J]. IEEE Trans. Compon. Packaging 32(2), 302 (2009)

Cited by 33 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging;Journal of Materials Science: Materials in Electronics;2024-02

2. Growth kinetics and IMCs layer analysis of SAC305 solder with the reinforcement of SiC during the isothermal aging condition;Journal of Materials Research and Technology;2023-05

3. Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment;2022 23rd International Conference on Electronic Packaging Technology (ICEPT);2022-08-10

4. Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

5. Drop Shock Performance of SAC-Bi Compared to SnPb;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3