Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging-Reference-Cited by-同舟云学术

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Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging

Published:2024-02 Issue:4 Volume:35 Page:
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Chen Yuanming^ORCID,Huang Junjie,Huang Yunzhong,Li Qingyuan,Zeng Hong,Tian Ling,Li Jingsong,Wang Shouxu,He Wei,Hong Yan

Funder

Industry-University-Research Collaboration of Zhuhai City

the Innovation Team Project of Zhuhai City

The project of International cooperation of Huangpu District

Publisher

Springer Science and Business Media LLC

Link

https://link.springer.com/content/pdf/10.1007/s10854-024-12043-3.pdf

Reference42 articles.

1. P.T. Vianco, A review of interface microstructures in electronic packaging applications: soldering technology. Jom 71, 158–177 (2018). https://doi.org/10.1007/s11837-018-3219-z

2. J.-W. Lee, H. Choi, U.-K. Hwang, J.-C. Kang, Y.J. Kang, K.I. Kim, J.-H. Kim, Toxic effects of lead exposure on bioaccumulation, oxidative stress, neurotoxicity, and immune responses in fish: a review. Environ. Toxicol. Phar. 68, 101–108 (2019). https://doi.org/10.1016/j.etap.2019.03.010

3. M. Bharath Krupa Teja, A. Sharma, S. Das, K. Das, A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics. J. Mater. Sci. Mater. Electron. 57, 8597–8633 (2022). https://doi.org/10.1007/s10853-022-07187-8

4. M. Arunasalam, Z.B. Leman, B.T.H.T.B. Baharudin, S.B. Sulaiman, C.S. Anthony Das, Challenges in minimizing copper dissolution for lead free wave soldering in surface mount technology going towards green manufacturing. Int. J. Pr Eng. Man-GT 9, 645–660 (2021). https://doi.org/10.1007/s40684-020-00298-0

5. J. Wang, S. Xue, P. Zhang, P. Zhai, Y. Tao, The reliability of lead-free solder joint subjected to special environment: a review. J. Mater. Sci. Mater. Electron. 30, 9065–9086 (2019). https://doi.org/10.1007/s10854-019-01333-w

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Tin–Phosphorus Alloy: The Impact of Temperature on Alloy Formation and the Influence of the Dross Amount on the Solder Bath Surface;Applied Sciences;2024-09-13

2. Correction: Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging;Journal of Materials Science: Materials in Electronics;2024-03

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