A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-022-07187-8.pdf
Reference255 articles.
1. Puttlitz KJ, Stalter KA (2004) Handbook of lead-free solder technology for microelectronic assemblies. Marcel Dekker, Inc., New York
2. Sharma A, Cheon JS, Jung JP (2019) Epoxy polymer solder pastes for micro-electronic packaging applications. J Weld Join 37(2):7–14. https://doi.org/10.5781/JWJ.2019.37.2.2
3. Davis M, Bond D (1999) Principles and practices of adhesive bonded structural joints and repairs. Int J Adhes Adhes 19:91–105. https://doi.org/10.1016/S01437496(98)00026-8
4. Srivastava AK, Sharma A (2017) Advances in joining and welding technologies for automotive and electronicapplications. Am J Mater Eng Technol 5(1):7–13. https://doi.org/10.5772/intechopen.91166
5. Sharma A, Shin YS, Jung JP (2015) Influence of various additional elements in Al based filler alloys forautomotive and brazing industry. J Weld Join 33(5):1–8. https://doi.org/10.5781/JWJ.2015.33.5.1
Cited by 19 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging;Journal of Materials Science: Materials in Electronics;2024-02
2. Sn-3.0Ag-0.5Cu Solder Enriched with Tb4O7 Nanoparticles for Mini-Light Emitting Diode Packaging;ACS Applied Nano Materials;2024-01-16
3. Sn–Bi–Ag Solder Enriched with Ta2O5 Nanoparticles for Flexible Mini-LED Microelectronic Packaging;ACS Applied Nano Materials;2024-01-09
4. Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints;Soldering & Surface Mount Technology;2024-01-01
5. The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy;Metals;2023-10-27
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3