A review on nanodispersed lead-free solders in electronics: synthesis, microstructure and intermetallic growth characteristics
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s10853-022-07187-8.pdf
Reference255 articles.
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3. Davis M, Bond D (1999) Principles and practices of adhesive bonded structural joints and repairs. Int J Adhes Adhes 19:91–105. https://doi.org/10.1016/S01437496(98)00026-8
4. Srivastava AK, Sharma A (2017) Advances in joining and welding technologies for automotive and electronicapplications. Am J Mater Eng Technol 5(1):7–13. https://doi.org/10.5772/intechopen.91166
5. Sharma A, Shin YS, Jung JP (2015) Influence of various additional elements in Al based filler alloys forautomotive and brazing industry. J Weld Join 33(5):1–8. https://doi.org/10.5781/JWJ.2015.33.5.1
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