Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications
Author:
Publisher
The Korean Welding and Joining Society
Link
http://e-jwj.org/upload/jwj-37-2-7.pdf
Reference58 articles.
1. Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications
2. Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes
3. Effect of ZrO2 Nanoparticles on the Microstructure of Al-Si-Cu Filler for Low-Temperature Al Brazing Applications
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