Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
Author:
Affiliation:
1. Université de Sherbrooke,3IT, IRT-LN2,Sherbrooke,Canada
2. IBM,Bromont,Canada
Funder
Natural Sciences and Engineering Research Council
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195523.pdf?arnumber=10195523
Reference43 articles.
1. Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints
2. Effect of isothermal aging on the microstructure, shear behavior and hardness of the Sn58Bi/Sn3.0Ag0.5Cu/Cu solder joints
3. Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys
4. Secondary IMC formation induced by Kirkendall voiding in Cu/Sn–3.5Ag solder joints
5. Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy
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