Low Temperature Soldering of 3D Printed Conductive Polymer Contacts
Author:
Affiliation:
1. Technical University of Sofia,Faculty of Electrical Engineering,Sofia,Bulgaria,1156
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10406189/10406190/10406262.pdf?arnumber=10406262
Reference13 articles.
1. Comparative Study of Process-Reliability Interaction of Additive Circuits with Low-Temperature Solders ECAs and Magnetically Oriented ACAs
2. Solder Joint Reliability of Fully Homogenised SAC-SnBi Low Temperature BGA Interconnections using Solid Liquid Inter-Diffusion (SLID)
3. A Review of Low-Temperature Solders in Microelectronics Packaging
4. Solderless Component Assembly: Novel Ecological Approach to Electronics Production
5. Integration of electronic components in the thermoplastic processing chain: possibilities through additive manufacturing using conductive materials
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