Sn–Bi–Ag Solder Enriched with Ta<sub>2</sub>O<sub>5</sub> Nanoparticles for Flexible Mini-LED Microelectronic Packaging-Reference-Cited by-同舟云学术

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Sn–Bi–Ag Solder Enriched with Ta₂O₅ Nanoparticles for Flexible Mini-LED Microelectronic Packaging

Published:2024-01-09 Issue:2 Volume:7 Page:1562-1571
ISSN:2574-0970
Container-title:ACS Applied Nano Materials
language:en
Short-container-title:ACS Appl. Nano Mater.

Author:

Sharma Ashutosh¹²^ORCID,Kang HyeJun³,Jung Jae Pil³

Affiliation:

1. Department of Materials Science and Engineering, Ajou University, Suwon, Gyeonggi-do 16499, Republic of Korea

2. Amity Institute of Applied Sciences, Amity University Jharkhand, Ranchi 834002, India

3. Department of Materials Science and Engineering, University of Seoul, Seoul 02504, Republic of Korea

Funder

Korea Institute for Advancement of Technology

Publisher

American Chemical Society (ACS)

Link

https://pubs.acs.org/doi/pdf/10.1021/acsanm.3c04209

Reference68 articles.

1. Lead-free Solders in Microelectronics

2. Thermal cycling, shear and insulating characteristics of epoxy embedded Sn-3.0Ag-0.5Cu (SAC305) solder paste for automotive applications

3. 5G and Packaging Technology, Recent Progress/Status and Items to be Considered

4. Effect of high temperature high humidity and thermal shock test on interfacial intermetallic compounds (IMCs) growth of low alpha solders

5. Effect of aluminium additions on wettability and intermetallic compound (IMC) growth of lead free Sn (2 wt. % Ag, 5 wt. % Bi) soldered joints

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