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2. 2) C.-F. Tseng: "InFO (Wafer Level Integrated Fan-Out) Technology," ECTC2016, pp. 1–6
3. 3) C.-T. Wang: "Signal and Power Integrity Analysis on Integrated Fan-out PoP (InFO_PoP) Technology for Next Generation Mobile Applications," ECTC2016, pp. 380–385
4. 4) S.-S. Yeh: "Warpage Modeling and Characterization of the Viscoelastic Relaxation for Cured Molding Process in Fan-Out Packages," ECTC2017, pp. 841–845
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