Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. Lead-free Solders in Microelectronics
2. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
3. Morphology, kinetics, and thermodynamics of solid-state aging of eutectic SnPb and Pb-free solders (Sn–3.5Ag, Sn–3.8Ag–0.7Cu and Sn–0.7Cu) on Cu
4. Electromigration induced ductile-to-brittle transition in lead-free solder joints
5. Creep deformation behavior of Sn–3.5Ag solder/Cu couple at small length scales
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3. Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps;Journal of Materials Research and Technology;2024-05
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