Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Polymers and Plastics,Mechanical Engineering,Mechanics of Materials,Ceramics and Composites
Reference56 articles.
1. Reliability issues of lead-free solder joints in electronic devices
2. TEM and EBSD characterization revealing the recrystallization process occurring in the Sn-3.0Ag-0.5Cu Ball Grid Array solder joints during thermal cycling
3. The effect of a concentration gradient on interfacial reactions in microbumps of Ni/SnAg/Cu during liquid-state soldering
4. Eliminate Kirkendall voids in solder reactions on nanotwinned copper
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1. Investigation on interfacial compound growth kinetics in Sn-0.7Cu/Cu solder joint and mechanism analysis: Experiments and molecular dynamics simulations;Materials Characterization;2024-09
2. Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate;Soldering & Surface Mount Technology;2024-08-13
3. Mechanical properties and microstructure evolution of Sn–Bi-based solder joints by microalloying regulation mechanism;Journal of Materials Research and Technology;2024-07
4. Influence behavior and mechanism of crystal orientation of Cu6Sn5 coating on interfacial intermetallic compounds growth in Sn-0.7Cu/Cu solder joint;Materials Characterization;2024-04
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