Author:
Huang Y.S.,Hsiao H.Y.,Chen Chih,Tu K.N.
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
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2. Reliability challenges in 3D IC packaging technology
3. Phase equilibria of the Sn–Ag–Ni ternary system and interfacial reactions at the Sn–Ag/Ni joints
4. Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction
5. Early stages of intermetallic compound formation and growth during lead-free soldering
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