Phase equilibria of the Sn–Ag–Ni ternary system and interfacial reactions at the Sn–Ag/Ni joints

Author:

Hsu Hsiu-feng,Chen Sinn-wen

Publisher

Elsevier BV

Subject

Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials

Reference18 articles.

1. An analysis of the current status of lead-free soldering;Richards,1999

2. Lead-free Solders in Microelectronics

3. Blair HD, Pan T-Y, Nicholson JM. In: Proceedings of the 1998 Electronic Components and Technology Conference. IEEE 1998, pp. 259–267

4. Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

5. Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrate

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