Retaining multi-oriented and fine grain structure with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding under isothermal aging treatment-Reference-Cited by-同舟云学术

Retaining multi-oriented and fine grain structure with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding under isothermal aging treatment

Published:2023-09 Issue: Volume:305 Page:127951
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Chao Chen-Sung,Wu Zih-You,Lee Yin-Ku,Huang Pin-Wei,Chang Shou-Yi,Tsai Su-Yueh,Duh Jenq-Gong^ORCID

Funder

National Tsing Hua University

National Science and Technology Council

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

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