Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment-Reference-Cited by-同舟云学术

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Research on Reliability of SnAg1.8/Cu Solder Joints in Extreme Environment

Published:2022-08-10 Issue: Volume: Page:
ISSN:
Container-title:2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
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Author:

Zhou Xiangsheng¹,Li Yuechan¹,Yang Xiaofeng²,Xie An¹,Wang Haozhong³,Cao Chunyan¹

Affiliation:

1. Xiamen University of Technology,School of Materials Science and Engineering,Xiamen,China

2. The Science and Technology on Reliability Physics and Application of Electronic Component Laboratory,Guangzhou,China

3. Harbin Institute of Technology (Shenzhen),Department of Materials Science and Engineering,Shenzhen,China

Funder

China Postdoctoral Science Foundation

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9872527/9872536/09872622.pdf?arnumber=9872622

Reference10 articles.

1. Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability

2. Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging;xi;Journal of Materials Science,2018

3. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures

4. Effect of extreme thermal shocking on the reliability of Sn50Pb49Sb1/Cu solder joint

5. Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

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