Development of SnAg-based lead free solders in electronics packaging-Reference-Cited by-同舟云学术

Development of SnAg-based lead free solders in electronics packaging

Published:2012-03 Issue:3 Volume:52 Page:559-578
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Zhang Liang,He Cheng-wen,Guo Yong-huan,Han Ji-guang,Zhang Yong-wei,Wang Xu-yan

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference204 articles.

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3. Tin-lead (SnPb) solder reaction in flip chip technology;Tu;Mater Sci Eng R,2001

4. Size effects in small scaled lead-free solder joints;Zimprich;J Mater Sci: Mater Electron,2008

5. Development of Sn–Zn lead-free solders bearing alloying elements;Zhang;J Mater Sci: Mater Electron,2010

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