Reliability and failure analysis of SAC 105 and SAC 1205N lead-free solder alloys during drop test events

Author:

Wu Mei-LingORCID,Lan Jia-Shen

Funder

Advanced Semiconductor Engineering, Inc

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference29 articles.

1. Board Level Drop Test Method of Components for Handheld Electronic Products;JEDEC Standard JESD22-B111,2003

2. Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test;Tee,2003

3. Impact life prediction modeling of TFBGA packages under board level drop test;Tee;Microelectron. Reliab.,2004

4. Novel numerical and experimental analysis of dynamic responses Under board level drop test;Tee,2004

5. Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact;Tee,2004

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