Funder
Advanced Semiconductor Engineering, Inc
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Board Level Drop Test Method of Components for Handheld Electronic Products;JEDEC Standard JESD22-B111,2003
2. Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test;Tee,2003
3. Impact life prediction modeling of TFBGA packages under board level drop test;Tee;Microelectron. Reliab.,2004
4. Novel numerical and experimental analysis of dynamic responses Under board level drop test;Tee,2004
5. Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact;Tee,2004
Cited by
21 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献