Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock
Author:
Affiliation:
1. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang 212003, China
2. Shanghai Motor Vehicle Inspection Certification and Tech Innovation Center Co., Ltd., Shanghai 201805, China
Abstract
Funder
Shanghai Motor Vehicle Inspection Certification & Tech Innovation Center Co., Ltd., Jiangsu Provincial Natural Science Fund Research Project
Jiangsu Provincial Six Talent Peaks
Jiangsu Provincial Postgraduate Research & Practice Innovation Program
Publisher
MDPI AG
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces
Link
https://www.mdpi.com/2079-6412/13/3/572/pdf
Reference43 articles.
1. Thermal performance prediction of a phase change material based heat-sink cooling system for a printed circuit board, using response surface method;Alshihmani;J. Energy Storage,2022
2. Multiscale characterization of the mechanical behavior of a printed circuit board (PCB);Atintoh;Mater. Today Commun.,2023
3. Comparative study of different natural fibre printed circuit board (PCB) composites;Kumar;Mater. Today Proc.,2021
4. Tang, J., Wan, X., and Zhang, L. (2022). A sustainable printed circuit board derived hierarchically porous carbon/polyaniline composites for supercapacitors. Ceram. Int.
5. Development of lead free solder for electronic components based on thermal analysis;Kumar;Mater. Today Proc.,2022
Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components;Soldering & Surface Mount Technology;2024-07-09
2. A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms;Defence Technology;2024-05
3. A machine learning and finite element simulation-based void inspection for higher solder joint reliability;Microelectronics Reliability;2024-03
4. Monitoring Industrial Systems Using ESP-NOW Protocol with Mesh and Ad Hoc Network;2023 15th IEEE International Conference on Industry Applications (INDUSCON);2023-11-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3