Multiscale characterization of the mechanical behavior of a printed circuit board (PCB)-Reference-Cited by-同舟云学术

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Multiscale characterization of the mechanical behavior of a printed circuit board (PCB)

Published:2023-03 Issue: Volume:34 Page:104968
ISSN:2352-4928
Container-title:Materials Today Communications
language:en
Short-container-title:Materials Today Communications

Author:

Atintoh A.^ORCID,Kpobie W.^ORCID,Bonfoh N.,Fendler M.,Addiego F.^ORCID,Lipinski P.^ORCID

Publisher

Elsevier BV

Subject

Materials Chemistry,Mechanics of Materials,General Materials Science

Reference32 articles.

1. Reliability of high aspect ratio plated through holes (PTH) for advanced printed circuit board (PCB) packages;Goval,1997

2. Predicting delamination in multilayer composite circuit boards with bonded microelectronic components;Akbari;Eng. Fract. Mech.,2018

3. Board level drop test method of components for handheld electronic products;JEDEC Solid State Technology Association,2003

4. Determination of the orthotropic material properties of individual layers of printed circuit boards;Fuchs;Microelectron. Reliab.,2012

5. Multiscale analysis of multilayer printed circuit board using mechanics of structure genome;Tao;Mech. Adv. Mater. Struct.,2019

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Application of Friction Riveting technique for the assembly of electronic components on printed circuit boards (PCB);The International Journal of Advanced Manufacturing Technology;2024-07-01

2. An Innovative Lift Control Board Design and Prototype Production Using CANbus Communication System and STM32 Microcontroller;The European Journal of Research and Development;2024-03-31

3. Orthotropic viscoelastic characterization of thin woven composites by a combination of experimental and numerical methods;Composite Structures;2023-11

4. Failure Analysis of Printed Circuit Board Solder Joint under Thermal Shock;Coatings;2023-03-07

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