Effect of Ag content on microstructure and mechanical properties of Sn−xAg−0.5Cu solder joints under rapid thermal shock
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference34 articles.
1. Microstructural evolution and tensile properties of Sn–5Sb solder alloy containing small amount of Ag and Cu [J];EL-DALY;Journal of Alloys and Compounds,2011
2. A review: Microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics [J];AAMIR;Soldering & Surface Mount Technology,2019
3. Effects of reflow atmosphere and flux on Sn whisker growth of Sn–Ag–Cu solders [J];BAATED;Journal of Materials Science: Materials in Electronics,2010
4. Electrodeposition and characterisation of Sn–Ag–Cu solder alloys for flip-chip interconnection [J];QIN;Electrochimica Acta,2010
5. A review on nanodispersed lead-free solders in electronics: Synthesis, microstructure and intermetallic growth characteristics [J];TEJA;Journal of Materials Science,2022
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