Funder
Hong Kong Electronic Packaging and Manufacturing Services Association Limited Scholarship
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference37 articles.
1. Flip Chip Technologies;Lau,1996
2. Solder Joint Technology: Materials, Properties, and Reliability;Tu,2007
3. Lead-Free Solder Interconnect Reliability;Shangguan,2005
4. Reliability challenges in 3D IC packaging technology;Tu;Microelectron. Reliab.,2011
5. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages;Chan;Prog. Mater. Sci.,2010
Cited by
46 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献