Effect of Trace Boron Nitride Nanoparticles on the Microstructure and Shear Properties of Sn58Bi Solder Joint
Author:
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Link
https://link.springer.com/content/pdf/10.1007/s11665-023-08607-9.pdf
Reference45 articles.
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2. K.N. Tu and Y. Liu, Recent Advances on Kinetic Analysis of Solder Joint Reactions in 3D IC Packaging Technology, Mater. Sci. Eng. R Rep., 2019, 136, p 1–12. https://doi.org/10.1016/j.mser.2018.09.002
3. R. Tian, C. Hang, Y. Tian, and L. Zhao, Growth Behavior of Intermetallic Compounds and Early Formation of Cracks in Sn-3Ag-0.5Cu Solder Joints Under Extreme Temperature Thermal Shock, Mater. Sci. Eng. A, 2018, 709, p 125–133. https://doi.org/10.1016/j.msea.2017.10.007
4. S.H. Rajendran, D.H. Cho, and J.P. Jung, Comparative Study on the Wettability and Thermal Aging Characteristics of SAC305 Nanocomposite Solder Fabricated by Stir-Casting and Ultrasonic Treatment, Mater. Today Commun., 2022, 31, p 103814. https://doi.org/10.1016/j.mtcomm.2022.103814
5. T. An and F. Qin, Effects of the Intermetallic Compound Microstructure on the Tensile Behavior of Sn3.0Ag0.5Cu/Cu Solder Joint Under Various Strain Rates, Microelectron. Reliab., 2014, 54, p 932–938. https://doi.org/10.1016/j.microrel.2014.01.008
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