Author:
Rajendran Sri Harini,Cho Do Hoon,Jung Jae Pil
Subject
Materials Chemistry,Mechanics of Materials,General Materials Science
Reference67 articles.
1. Mechanical properties of Pb-free SnAg solder joints;Keller;Acta Mater.,2011
2. J.-W. Nah, J. Gelorme, P. Sorce, P. Lauro, E. Perfecto, M. McLeod, K. Toriyama, Y. Orii, P. Brofman, T. Nauchi, A. Takaguchi, K. Ishiguro, T. Yoshikawa, D. Daily, R. Suzuki, Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), (2014), pp. 1308–1313.
3. MLCC solder joint property with vacuum and hot air reflow soldering processes;Hong;J. Weld. Join.,2021
4. Ceria reinforced nanocomposite solder foils fabricated by accumulative roll bonding process;Roshanghias;J. Mater. Sci: Mater. Electron,2012
5. Influence of dual ceramic nanomaterials on the solderability and interfacial reactions between lead-free Sn-Ag-Cu and a Cu conductor;Jung;J. Alloy. Compd.,2018
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