Mechanical properties of Pb-free SnAg solder joints
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference20 articles.
1. Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints
2. Mechanical strength of Sn-3.5Ag-based solders and related bondings
3. Microstructural damage analysis of SnAgCu solder joints and an assessment on indentation procedures
4. Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications
5. The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder
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