Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints-Reference-Cited by-同舟云学术

Microstructure Characterization and Creep Behavior of Pb-Free Sn-Rich Solder Alloys: Part I. Microstructure Characterization of Bulk Solder and Solder/Copper Joints

Published:2008-01-09 Issue:2 Volume:39 Page:340-348
ISSN:1073-5623
Container-title:Metallurgical and Materials Transactions A
language:en
Short-container-title:Metall and Mat Trans A

Author:

Sidhu R.S.,Chawla N.

Publisher

Springer Science and Business Media LLC

Subject

Metals and Alloys,Mechanics of Materials,Condensed Matter Physics

Link

http://link.springer.com/content/pdf/10.1007/s11661-007-9414-0.pdf

Reference65 articles.

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3. J.W. Jang, A.P. De Silva, T.Y. Lee, J.K. Lee, D.R. Frear: Appl. Phys. Lett., 2001, vol. 79, pp. 482–84

4. K.J. Puttlitz, K.A. Stalter: Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, Marcel Dekker Inc., New York, NY, 2004, p. 211

5. C.M.L. Wu, M.L. Huang: J. Electron. Mater., 2002, vol. 31, pp. 442–48

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