Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.1388160
Reference9 articles.
1. Future challenges in electronics packaging
2. Lead-free Solders in Microelectronics
3. Microstructure evolution of eutectic Sn-Ag solder joints
4. New Pb‐free solder alloy with superior mechanical properties
5. Lead (Pb)-free solders for electronic packaging
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3. Graphene as a diffusion barrier at the interface of Liquid–State low-melting Sn–58Bi alloy and copper foil;Applied Surface Science;2022-03
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