High-Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead-Free Solder
Author:
Affiliation:
1. Arizona State University; Tempe Arizona 85287-6106 USA
2. IMDEA Materials Institute; c/Eric Kandel 2 Getafe Madrid 28906 Spain
Publisher
Wiley
Subject
Condensed Matter Physics,General Materials Science
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/adem.201500089/fullpdf
Reference35 articles.
1. Thermomechanical behaviour of environmentally benign Pb-free solders
2. Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology
3. The creep of lead-free solders at elevated temperatures
4. Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
5. The creep properties of lead-free solder joints
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