Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints-Reference-Cited by-同舟云学术

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Effect of Joint Size on Creep Behavior of Sn-Ag-Cu Solder-Cu Joints

Published:2022-11-29 Issue:2 Volume:52 Page:739-750
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:J. Electron. Mater.

Author:

Kanjilal Anwesha,Narayanan P. Ramesh,Agilan M.,Kumar Praveen

Funder

ISRO-IISc Space Technology Cell

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://link.springer.com/content/pdf/10.1007/s11664-022-10065-3.pdf

Reference40 articles.

1. K.N. Tu, Reliability challenges in 3D IC packaging technology. Microelectron. Reliab. 51, 517–523 (2011). https://doi.org/10.1016/j.microrel.2010.09.031.

2. K.N. Tu, H. Hsiao, and C. Chen, Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy. Microelectron. Reliab. 53, 2–6 (2013). https://doi.org/10.1016/j.microrel.2012.07.029.

3. S. Wang, Y. Yao, and X. Long, Critical review of size effects on microstructure and mechanical properties of solder joints for electronic packaging. Appl. Sci. 9, 1–15 (2019). https://doi.org/10.3390/app9020227.

4. R.S. Sidhu and N. Chawla, Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys: Part I. Microstructure characterization of bulk solder and solder/copper joints. Metall. Mater. Trans. A Phys. Metall. Mater. Sci. 39, 340–348 (2008). https://doi.org/10.1007/s11661-007-9414-0.

5. R.S. Sidhu, X. Deng, and N. Chawla, Microstructure characterization and creep behavior of Pb-free Sn-rich solder alloys Part II. Creep behavior of bulk solder and solder/copper joints. Metall. Mater. Trans. A Phys. Metall. Mater. Sci. 39, 349–362 (2008). https://doi.org/10.1007/s11661-007-9412-2.

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1. Effect of Ni-RGO nanosheets on the creep behavior of Sn–Ag–Cu composite solder joints;Materials Chemistry and Physics;2024-10

2. Reliability and thermal fatigue life prediction of solder joints using nanoindentation;Materials Today Communications;2024-06

3. Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization;Journal of Materials Science: Materials in Electronics;2024-02

4. Reliability and Thermal Fatigue Life Prediction of Solder Joints Using Nanoindentation;2023

5. Effect of Ni-Decorated Graphene Nanosheets On the Creep Behavior of Sn-3.0ag-0.5cu Solder Joints;2023

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