Reliability and Thermal Fatigue Life Prediction of Solder Joints Using Nanoindentation

Author:

Cao Jie,Lan Xin,Cui Xiao,Shi Zhirun,XIN Gongming,Cheng Yong

Publisher

Elsevier BV

Reference42 articles.

1. New challenges of miniaturization of electronic devices: Electromigration and thermomigration in lead-free solder joints;P Zhang;Mater. Des,2020

2. Research on thermal fatigue failure mechanism of BGA solder joints based on microstructure evolution;Q Li;Int. J. Fatigue,2023

3. Solder joint failures under thermo-mechanical loading conditions -A review;J Depiver;Adv. Mater. Process. Technol,2021

4. Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies;V Voet;Int. J. Fatigue,2023

5. A review: On the development of low melting temperature Pb-free solders;H R Kotadia;Microelectron. Reliab,2014

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