Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications-Reference-Cited by-同舟云学术

Development of Sn–Ag–Cu and Sn–Ag–Cu–X alloys for Pb-free electronic solder applications

Published:2006-09-27 Issue:1-3 Volume:18 Page:55-76
ISSN:0957-4522
Container-title:Journal of Materials Science: Materials in Electronics
language:en
Short-container-title:J Mater Sci: Mater Electron

Author:

Anderson Iver E.

Publisher

Springer Science and Business Media LLC

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s10854-006-9011-9.pdf

Reference65 articles.

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3. Refer to websites at http://www.lead-free.org/legislation/, http://www.nemi.org/PbFreepublic/, and http://www.jeida.org.jp/english/information/pbfree/roadmap.html/ for information on relevant organization activities

4. C.M. Miller, I.E. Anderson, J.F. Smith, J. Electron. Mater. 23, 595 (1994)

5. I.E. Anderson, F.G. Yost, J.F. Smith, C.M. Miller, R.L. Terpstra, U.S. Patent No. 5,527,628, June 18, 1996

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