Comparative Study on the Effect of Surface Finish on Mechanical Properties of Solder Joints
Author:
Affiliation:
1. Technical University of Kosice,Kosice,Slovakia
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168461.pdf?arnumber=10168461
Reference15 articles.
1. Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing
2. Interfacial reaction and mechanical properties of eutectic Sn–0.7Cu/Ni BGA solder joints during isothermal long-term aging
3. Shear strength and brittle failure of low-Ag SAC-Bi-Ni solder joints during ball shear test
4. Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging
5. Influence of reflow and thermal aging on the shear strength and fracture behavior of Sn-3.5Ag solder/Cu joints
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