Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility-Reference-Cited by-同舟云学术

Wafer IMS (Injection molded solder) — A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility

Published:2014-05 Issue: Volume: Page:
ISSN:
Container-title:2014 IEEE 64th Electronic Components and Technology Conference (ECTC)
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Author:

Nah Jae-Woong,Gelorme Jeffrey,Sorce Peter,Lauro Paul,Perfecto Eric,McLeod Mark,Toriyama Kazushige,Orii Yasumitsu,Brofman Peter,Nauchi Takashi,Takaguchi Akira,Ishiguro Kazuya,Yoshikawa Tomoyasu,Daily Derek,Suzuki Ryoichi

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6884273/6897249/06897461.pdf?arnumber=6897461

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