Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Effect of the addition of CeO2 nanoparticles on the microstructure and shear properties of Sn–57Bi–1Ag solder alloy

Published:2023-09 Issue: Volume:26 Page:1062-1078
ISSN:2238-7854
Container-title:Journal of Materials Research and Technology
language:en
Short-container-title:Journal of Materials Research and Technology

Author:

Zhang Lei,Yang Wenchao,Feng Junli,Qin Weiou,Qi Da,Song Shijie,Zhan Yongzhong

Funder

Natural Science Foundation of Guangxi Province

Guangxi Normal University

General Administration of Customs

National Natural Science Foundation of China

Publisher

Elsevier BV

Subject

Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites

Reference62 articles.

1. Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products;Tu;Sci China Technol Sci,2013

2. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection;Knickerbocker;IBM J Res Dev,2005

3. Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology;Wu;J Mater Res Technol,2023

4. Effect of Ni-modified reduced graphene oxide on the mechanical properties of Sn-58Bi solder joints;Qin;Vacuum,2023

5. Composition, microstructure, phase constitution and fundamental physicochemical properties of low-melting-point multi-component eutectic alloys;Zhou;J Mater Sci Technol,2017

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effect of electromigration on microstructure and properties of CeO2 nanopartical-reinforced Sn58Bi/Cu solder joints;Scientific Reports;2024-07-08

2. Al2O3 nanofibers reinforced Sn58Bi/SAC 305 hybrid joints for low temperature ball grid array bonding;Materials Today Communications;2024-03

3. Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn–Bi lead-free solder alloy;Journal of Materials Research and Technology;2023-09

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号京ICP备18003416号-3