Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection-Reference-Cited by-同舟云学术

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

Published:2005-07 Issue:4.5 Volume:49 Page:725-753
ISSN:0018-8646
Container-title:IBM Journal of Research and Development
language:
Short-container-title:IBM J. Res. & Dev.

Author:

Knickerbocker J. U.,Andry P. S.,Buchwalter L. P.,Deutsch A.,Horton R. R.,Jenkins K. A.,Kwark Y. H.,McVicker G.,Patel C. S.,Polastre R. J.,Schuster C. D.,Sharma A.,Sri-Jayantha S. M.,Surovic C. W.,Tsang C. K.,Webb B. C.,Wright S. L.,McKnight S. R.,Sprogis E. J.,Dang B.

Publisher

IBM

Subject

General Computer Science

Link

http://xplorestaging.ieee.org/ielx5/5288520/5388808/05388819.pdf?arnumber=5388819

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