Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints-Reference-Cited by-同舟云学术

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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 µm-Pitch Solder Joints

Published:2024-05-28 Issue: Volume: Page:269-273
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Horibe Akihiro¹,Watanabe Takahito¹,Marushima Chinami¹,Kohara Sayuri¹,Yamada Yasuharu¹,Mori Hiroyuki¹,Taneja Divya²,Pilger Katherine²,Jacques-Fortin Alexis²,Godard Maxime²,Chen Qianwen³,Perfecto Eric⁴,Jain Aakrati⁴,Ross Joseph R⁴,Wassick Thomas⁵,De Sousa Isabel²

Affiliation:

1. IBM Research – Tokyo,Kawasaki,Japan

2. IBM Infrastructure,Bromont,Canada

3. IBM Research – Yorktown Heights,Yorktown Heights,USA

4. IBM Research – Albany,Albany,USA

5. IBM Infrastructure,East Fishkill,USA

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565142.pdf?arnumber=10565142

Reference7 articles.

1. Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection

2. Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

3. Development of 2.3D High Density Organic Package using Low Temperature Bonding Process with Sn-Bi Solder

4. Direct Bonded Heterogeneous Integration (DBHi) Si Bridge

5. Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling

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