Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect-Reference-Cited by-同舟云学术

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Embedded Multi-die Interconnect Bridge (EMIB) -- A High Density, High Bandwidth Packaging Interconnect

Published:2016-05 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
language:
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Author:

Mahajan Ravi,Sankman Robert,Patel Neha,Kim Dae-Woo,Aygun Kemal,Qian Zhiguo,Mekonnen Yidnekachew,Salama Islam,Sharan Sujit,Iyengar Deepti,Mallik Debendra

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7542794/7545393/07545486.pdf?arnumber=7545486

Cited by 179 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. EMIB and advanced substrate packaging technologies to enable heterogeneous integration (HI) applications;Japanese Journal of Applied Physics;2024-01-08

2. Heat transfer enhancement for 3D chip thermal simulation and prediction;Applied Thermal Engineering;2024-01

3. An optimized FPGA architecture for machine learning applications;AEU - International Journal of Electronics and Communications;2024-01

4. Into the Third Dimension: Architecture Exploration Tools for 3D Reconfigurable Acceleration Devices;2023 International Conference on Field Programmable Technology (ICFPT);2023-12-12

5. A Polymer-Based Embedded Silicon Fan-Out Packaging (P-eSiFO) Method for High-Density Chiplet Packaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-11

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