Affiliation:
1. School of Integrated Circuits, Peking University, Beijing, China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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1. Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
2. Flexible MEMS-IC Microsystem by a Wafer-Level F-eSiFO Integration Process;2024 IEEE 37th International Conference on Micro Electro Mechanical Systems (MEMS);2024-01-21