Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package-Reference-Cited by-同舟云学术

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Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package

Published:2024-05-28 Issue: Volume: Page:2280-2285
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Yang Zhou¹,Yang Yuchi¹,Lyu Peijue¹,Du Jianyu¹,Chen Lang¹,Kang Jin²,Bu Weihai²,Zheng Kai²,Zhou Yikang²,Zhang Chi³,Wang Wei³

Affiliation:

1. Peking University,School of Integrated Circuits,Beijing,China

2. Innovation Center (Beijing) Corporation,Semiconductor Technology,Beijing,China

3. Peking University; National Key Laboratory of Science and Technology on Micro/Nano Fabrication,School of Integrated Circuits,Beijing,China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565064.pdf?arnumber=10565064

Reference16 articles.

1. Is 3D chip technology the next growth engine for performance improvement?

2. Thermal management of 3D IC integration with TSV (through silicon via)

3. 3D stacked microfluidic cooling for high-performance 3D ICs

4. Integration of intra chip stack fluidic cooling using thin-layer solder bonding

5. Guidelines on thermal management solutions for modern packaging technologies - a review

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