3D stacked microfluidic cooling for high-performance 3D ICs-Reference-Cited by-同舟云学术

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3D stacked microfluidic cooling for high-performance 3D ICs

Published:2012-05 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 62nd Electronic Components and Technology Conference
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Author:

Zhang Yue,Dembla Ashish,Joshi Yogendra,Bakir Muhannad S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6241679/6248788/06249058.pdf?arnumber=6249058

Cited by 27 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Process Development of Manifold Microchannels Cooling for Embedded Silicon Fan-Out (MMC-eSiFO) Package;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Thermal Heating in ReRAM Crossbar Arrays: Challenges and Solutions;IEEE Open Journal of Circuits and Systems;2024

3. Optimization of the Thermal Performance of Three-Dimensional Integrated Circuits Utilizing Rectangular-Shaped and Disk-Shaped Heat Pipes;Journal of Heat Transfer;2022-03-04

4. Complex 3D microfluidic architectures formed by mechanically guided compressive buckling;Science Advances;2021-10-22

5. A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs);IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-05

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