Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder-Reference-Cited by-同舟云学术

Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder

Published:2008-04 Issue:1-2 Volume:453 Page:180-184
ISSN:0925-8388
Container-title:Journal of Alloys and Compounds
language:en
Short-container-title:Journal of Alloys and Compounds

Author:

Shi Yaowu,Tian Jun,Hao Hu,Xia Zhidong,Lei Yongping,Guo Fu

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference13 articles.

1. Directive 2002/95/EC, The Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, The European Parliament and of the Council of the European Union, 27 January 2003.

2. Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

3. Study on the microstructure of a novel lead-free solder alloy SnAgCu-RE and its soldered joints

4. Properties of lead-free solder SnAgCu containing minute amounts of rare earth

5. Constitutive relations on creep for SnAgCuRE lead-free solder joints

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